Ultimate Vacuum: Better than5x10^-8 Torr

Holds eight 2-inch confocal sputtering in-situ deflection target sources and three 2-inch center flange sputtering targets.

Ultra-thin film deposition, deposition rate can be controlled.

Deposition uniformity: better than ±1.5% @ 4" (100mm) substrate

Sample stage: Heating at 850°C, rotating 0-40RPM, RF/DC bias

Power supplies such as RF, DC, Pulsed DC, and HiPIMS

Can integrate 4 MFC gas circuits(Ar、O₂、N₂、H₂ etc.)

Semi-automatic control or LabVIEW computer control

Load-Lock/Pre-vacuum chamber

HV or UHV (e-10^-7 to e-10^-10 Torr)

Coating materials: metals, dielectrics, ceramics, superconductors, transparent conductive oxides, magnetic materials, organic materials, piezoelectric materials, etc.